Abstract
Cu-Nb-Cu microcomposite reinforced by Nb tube was successfully fabricated by accumulative drawing and bundling process. When the strength of the Cu-Nb-Cu composite reaches above 1 GPa, the conductivity can reach 67% International Annealed Copper Standard (IACS). The annealing effects on the microstructure and properties of the Cu-Nb-Cu microcomposite have been thoroughly discussed. Annealing temperature at 750 °C can lead to an obvious change of microstructures. Both the partial spheroidization and further coarsening of niobium filaments in Cu-Nb-Cu microcomposite have been revealed. The influences of the microstructure changes on the mechanical and electrical properties have also been analyzed.
Original language | English |
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Article number | 6000205 |
Journal | IEEE Transactions on Applied Superconductivity |
Volume | 29 |
Issue number | 4 |
DOIs | |
State | Published - Jun 2019 |
Externally published | Yes |
Keywords
- Accumulative drawing and bundling (ADB) process
- Cu-Nb-Cu microcomposites
- mechanical properties
- microstructure