TY - GEN
T1 - Flexible thermal sensor array on PI film substrate for underwater applications
AU - Ma, Binghe
AU - Ren, Jinzhong
AU - Deng, Jinjun
AU - Yuan, Weizheng
PY - 2010
Y1 - 2010
N2 - Fully flexible thermal sensor array was developed for underwater applications. To minimize conductive heat loss to substrate and shorten response time nickel thin film resistors are fabricated on polyimide film substrate. This flexible sensing belt can be applied onto highly curved non-planar surfaces to measure flow with minimal invasion. Polymer compatible micromachining technology with consideration of waterproof coating was developed. Through calibration performed under constant-current excitation, high temperature coefficient of resistance (TCR) and low time constant of sensor were obtained. Hydrodynamic experiments in water channels were carried out, and it indicates dynamic wave flow can be sensed promptly with this sensing belt.
AB - Fully flexible thermal sensor array was developed for underwater applications. To minimize conductive heat loss to substrate and shorten response time nickel thin film resistors are fabricated on polyimide film substrate. This flexible sensing belt can be applied onto highly curved non-planar surfaces to measure flow with minimal invasion. Polymer compatible micromachining technology with consideration of waterproof coating was developed. Through calibration performed under constant-current excitation, high temperature coefficient of resistance (TCR) and low time constant of sensor were obtained. Hydrodynamic experiments in water channels were carried out, and it indicates dynamic wave flow can be sensed promptly with this sensing belt.
UR - http://www.scopus.com/inward/record.url?scp=77952778085&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2010.5442315
DO - 10.1109/MEMSYS.2010.5442315
M3 - 会议稿件
AN - SCOPUS:77952778085
SN - 9781424457649
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 679
EP - 682
BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Y2 - 24 January 2010 through 28 January 2010
ER -