Abstract
The fabrication processing, dielectric properties and thermal properties of polymer-matrix composites containing AlN particles for electronic substrates and microelectronic packaging applications are investigated. The epoxy resin is used as the polymer matrix in the composites. The properties of the composites are measured in the range of AlN contents changing from 0.00 to 30vol%. With increasing the content of AlN particles, thermal conducting of composites is improved, while the composites still keep the relatively low dielectric constant and dielectric loss.
| Original language | English |
|---|---|
| Pages (from-to) | 341-342 |
| Number of pages | 2 |
| Journal | Hangkong Cailiao Xuebao/Journal of Aeronautical Materials |
| Volume | 26 |
| Issue number | 3 |
| State | Published - Jun 2006 |
Keywords
- Cole-Cole plot
- Epoxy reins
- Substrate material
- Thermal conductivity