Abstract
Fatigue experiments were conducted on Sn-3.5Ag solder alloys to study the fatigue failure of Sn-Ag eutectic solder. Fatigue crack propagation in Mode I loading was studied utilizing a solder-joint plate specimen. Fatigue crack propagation tests were performed at room temperature in a servo-hydraulic fatigue machine (MTS-810) under load control with maximum load of 2400N and the load ratio of 0.1. The crack growth was monitored by a traveling microscope. Scanning electron microscopy (SEM) and optical microscope examinations were performed directly on the specimens. It is found that the crack gradually propagates in a direction approximately perpendicular to the stress direction through the region with accumulation of dislocations. After 867000 cycles, when the crack grew to approximately 13mm in the horizontal direction, the crack migrated to the copper/solder interface resulting in sudden catastrophic failure. A micromechanics approach was applied to predict fatigue crack propagation, which matches good with experimental data.
| Original language | English |
|---|---|
| Title of host publication | Fatigue of Materials |
| Subtitle of host publication | Advances and Emergences in Understanding |
| Publisher | Wiley Blackwell |
| Pages | 19-28 |
| Number of pages | 10 |
| ISBN (Electronic) | 9781118013373 |
| ISBN (Print) | 9780470943182 |
| DOIs | |
| State | Published - 11 Nov 2010 |
| Externally published | Yes |
Keywords
- Crack propagation
- Experiment
- Failure
- Fatigue
- Phase transformation
- Sn-Ag solder