Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan

J. T. Xiong; J. R. Sun; J. C. Wang; H. Zhang; J. M. Shi; J. L. Li

doi:10.1016/j.jmapro.2019.09.025

Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan

J. T. Xiong, J. R. Sun, J. C. Wang, H. Zhang, J. M. Shi, J. L. Li

School of Materials Sience and Engineering

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

The immersion ultrasonic C-scan ((IUCT) test was conducted for evaluating the bonded ratio of the TC4 diffusion bonded joints. The signal characteristics reflected by the typical bonding states of the joint, gap, kissing bond, microvoids and sound bond were investigated in the time and frequency domain. Moreover, as for the bonding state of microvoids, its local bonded ratio exhibited a linear relationship with the relative amplitude of its echo signal in the time domain. Based on the echo signal characteristics and the linear relationship about microvoids, a MATLAB algorithm program was developed to calculate the global bonded ratio of bonding interface directly from echo signal of IUCT. The results demonstrated that joint bonded ratio and mechanical properties, especially the tensile strength, could be quantitively evaluated by the combination of IUCT test and the developed MATLAB program.

Original language	English
Pages (from-to)	238-243
Number of pages	6
Journal	Journal of Manufacturing Processes
Volume	47
DOIs	https://doi.org/10.1016/j.jmapro.2019.09.025
State	Published - Nov 2019

Keywords

Bonded ratio
Diffusion bonding
Titanium alloy
Ultrasonic C-scan

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10.1016/j.jmapro.2019.09.025

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title = "Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan",

abstract = "The immersion ultrasonic C-scan ((IUCT) test was conducted for evaluating the bonded ratio of the TC4 diffusion bonded joints. The signal characteristics reflected by the typical bonding states of the joint, gap, kissing bond, microvoids and sound bond were investigated in the time and frequency domain. Moreover, as for the bonding state of microvoids, its local bonded ratio exhibited a linear relationship with the relative amplitude of its echo signal in the time domain. Based on the echo signal characteristics and the linear relationship about microvoids, a MATLAB algorithm program was developed to calculate the global bonded ratio of bonding interface directly from echo signal of IUCT. The results demonstrated that joint bonded ratio and mechanical properties, especially the tensile strength, could be quantitively evaluated by the combination of IUCT test and the developed MATLAB program.",

keywords = "Bonded ratio, Diffusion bonding, Titanium alloy, Ultrasonic C-scan",

author = "Xiong, {J. T.} and Sun, {J. R.} and Wang, {J. C.} and H. Zhang and Shi, {J. M.} and Li, {J. L.}",

note = "Publisher Copyright: {\textcopyright} 2019 The Society of Manufacturing Engineers",

year = "2019",

month = nov,

doi = "10.1016/j.jmapro.2019.09.025",

language = "英语",

volume = "47",

pages = "238--243",

journal = "Journal of Manufacturing Processes",

issn = "1526-6125",

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T1 - Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan

AU - Xiong, J. T.

AU - Sun, J. R.

AU - Wang, J. C.

AU - Zhang, H.

AU - Shi, J. M.

AU - Li, J. L.

PY - 2019/11

Y1 - 2019/11

N2 - The immersion ultrasonic C-scan ((IUCT) test was conducted for evaluating the bonded ratio of the TC4 diffusion bonded joints. The signal characteristics reflected by the typical bonding states of the joint, gap, kissing bond, microvoids and sound bond were investigated in the time and frequency domain. Moreover, as for the bonding state of microvoids, its local bonded ratio exhibited a linear relationship with the relative amplitude of its echo signal in the time domain. Based on the echo signal characteristics and the linear relationship about microvoids, a MATLAB algorithm program was developed to calculate the global bonded ratio of bonding interface directly from echo signal of IUCT. The results demonstrated that joint bonded ratio and mechanical properties, especially the tensile strength, could be quantitively evaluated by the combination of IUCT test and the developed MATLAB program.

AB - The immersion ultrasonic C-scan ((IUCT) test was conducted for evaluating the bonded ratio of the TC4 diffusion bonded joints. The signal characteristics reflected by the typical bonding states of the joint, gap, kissing bond, microvoids and sound bond were investigated in the time and frequency domain. Moreover, as for the bonding state of microvoids, its local bonded ratio exhibited a linear relationship with the relative amplitude of its echo signal in the time domain. Based on the echo signal characteristics and the linear relationship about microvoids, a MATLAB algorithm program was developed to calculate the global bonded ratio of bonding interface directly from echo signal of IUCT. The results demonstrated that joint bonded ratio and mechanical properties, especially the tensile strength, could be quantitively evaluated by the combination of IUCT test and the developed MATLAB program.

KW - Bonded ratio

KW - Diffusion bonding

KW - Titanium alloy

KW - Ultrasonic C-scan

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DO - 10.1016/j.jmapro.2019.09.025

M3 - 文章

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VL - 47

SP - 238

EP - 243

JO - Journal of Manufacturing Processes

JF - Journal of Manufacturing Processes

ER -

Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan

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Keywords

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