Enhanced thermal conductivity of SiCp/PS composites by electrospinning-hot press technique

Junwei Gu, Zhaoyuan Lv, Yalan Wu, Ruoxi Zhao, Lidong Tian, Qiuyu Zhang

Research output: Contribution to journalArticlepeer-review

101 Scopus citations

Abstract

Silicon carbide particle/polystyrene (SiCp/PS) electrospun mats are firstly prepared by electrospinning technology, then to be fabricated the corresponding thermally conductive SiCp/PS composites by the method of "laminating-hot press". The mass fraction of SiCp and laminating mode of SiCp/PS electrospun mats affecting on the thermal conductivities, dielectric and thermal properties of the composites are investigated. The addition of 32.8 vol% SiCp improves the thermally conductive coefficient λ of pure PS from 0.182 to 0.566 W/m K and thermal diffusivity of pure PS from 0.169 to 0.376 mm2/s, whereas the dielectric constant values still remain at relatively low levels. The thermal stabilities of the SiCp/PS composites are increased with the increasing addition of SiCp. For a given SiCp loading, the SiCp/PS composites from warp-weft arrangement of SiCp/PS electrospun mats possess relative higher thermally conductive coefficient λ and dielectric constant values than those of SiCp/PS composites from warp-warp arrangement of SiCp/PS electrospun mats.

Original languageEnglish
Pages (from-to)8-13
Number of pages6
JournalComposites Part A: Applied Science and Manufacturing
Volume79
DOIs
StatePublished - 1 Dec 2015

Keywords

  • A. Polymer-matrix composites (PMCs)
  • B. Thermal properties
  • E. Compression moulding

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