TY - JOUR
T1 - Enhanced thermal conductivity of SiCp/PS composites by electrospinning-hot press technique
AU - Gu, Junwei
AU - Lv, Zhaoyuan
AU - Wu, Yalan
AU - Zhao, Ruoxi
AU - Tian, Lidong
AU - Zhang, Qiuyu
N1 - Publisher Copyright:
© 2015 Elsevier Ltd.
PY - 2015/12/1
Y1 - 2015/12/1
N2 - Silicon carbide particle/polystyrene (SiCp/PS) electrospun mats are firstly prepared by electrospinning technology, then to be fabricated the corresponding thermally conductive SiCp/PS composites by the method of "laminating-hot press". The mass fraction of SiCp and laminating mode of SiCp/PS electrospun mats affecting on the thermal conductivities, dielectric and thermal properties of the composites are investigated. The addition of 32.8 vol% SiCp improves the thermally conductive coefficient λ of pure PS from 0.182 to 0.566 W/m K and thermal diffusivity of pure PS from 0.169 to 0.376 mm2/s, whereas the dielectric constant values still remain at relatively low levels. The thermal stabilities of the SiCp/PS composites are increased with the increasing addition of SiCp. For a given SiCp loading, the SiCp/PS composites from warp-weft arrangement of SiCp/PS electrospun mats possess relative higher thermally conductive coefficient λ and dielectric constant values than those of SiCp/PS composites from warp-warp arrangement of SiCp/PS electrospun mats.
AB - Silicon carbide particle/polystyrene (SiCp/PS) electrospun mats are firstly prepared by electrospinning technology, then to be fabricated the corresponding thermally conductive SiCp/PS composites by the method of "laminating-hot press". The mass fraction of SiCp and laminating mode of SiCp/PS electrospun mats affecting on the thermal conductivities, dielectric and thermal properties of the composites are investigated. The addition of 32.8 vol% SiCp improves the thermally conductive coefficient λ of pure PS from 0.182 to 0.566 W/m K and thermal diffusivity of pure PS from 0.169 to 0.376 mm2/s, whereas the dielectric constant values still remain at relatively low levels. The thermal stabilities of the SiCp/PS composites are increased with the increasing addition of SiCp. For a given SiCp loading, the SiCp/PS composites from warp-weft arrangement of SiCp/PS electrospun mats possess relative higher thermally conductive coefficient λ and dielectric constant values than those of SiCp/PS composites from warp-warp arrangement of SiCp/PS electrospun mats.
KW - A. Polymer-matrix composites (PMCs)
KW - B. Thermal properties
KW - E. Compression moulding
UR - http://www.scopus.com/inward/record.url?scp=84942102084&partnerID=8YFLogxK
U2 - 10.1016/j.compositesa.2015.09.005
DO - 10.1016/j.compositesa.2015.09.005
M3 - 文章
AN - SCOPUS:84942102084
SN - 1359-835X
VL - 79
SP - 8
EP - 13
JO - Composites Part A: Applied Science and Manufacturing
JF - Composites Part A: Applied Science and Manufacturing
ER -