TY - GEN
T1 - Enhanced heat transfer and thermal performance of metal foam microchannel heat sinks with internal Y-shaped bifurcation
AU - Shen, Han
AU - Liu, Xueting
AU - Sunden, Bengt
AU - Xie, Gongnan
N1 - Publisher Copyright:
Copyright © 2016 by ASME.
PY - 2016
Y1 - 2016
N2 - Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.
AB - Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.
KW - Metallic foam
KW - Microchannel heat sinks
KW - Thermal performance
KW - Y-shaped bifurcation
UR - http://www.scopus.com/inward/record.url?scp=85021831994&partnerID=8YFLogxK
U2 - 10.1115/IMECE201666449
DO - 10.1115/IMECE201666449
M3 - 会议稿件
AN - SCOPUS:85021831994
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Heat Transfer and Thermal Engineering
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2016 International Mechanical Engineering Congress and Exposition, IMECE 2016
Y2 - 11 November 2016 through 17 November 2016
ER -