Effect of partial melting parameters on the microstructures and critical current density of Bi-2212 thick films

Shengnan Zhang, Chengshan Li, Qingbin Hao, Lulu Song, Yilei Zhang, Pingxiang Zhang, Rui Hu

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

Bi2.1Sr1.96CaxCu2.0Ox (Bi-2212) thick films with Ag substrates were prepared through dip coating process. By X-ray diffraction (XRD) and scanning electron microscopy (SEM) characterizations, the influences of heat treatment parameters on the phase transition process and the aligned growth of Bi-2212 grains have been systematically studied. The maximum heat treatment temperature, Tmax, and cooling rate, Rc has been optimized. Meanwhile, the influences of the coating density on the microstructures and the transport properties have also been discussed by applying an additional cold pressing. The Jc value of over 7300 A/cm2 (77 K, self field) has been obtained from the direct powder pressing process, which is over 60% higher than that from the traditional dip coating thick film.

Original languageEnglish
Pages (from-to)1588-1593
Number of pages6
JournalPhysics Procedia
Volume36
DOIs
StatePublished - 2012
EventSuperconductivity Centennial Conference, SCC 2011 - The Hague, Netherlands
Duration: 18 Sep 201123 Sep 2011

Keywords

  • Bi-2212
  • Dip coating
  • High-temperature superconductor
  • Partial melting process

Fingerprint

Dive into the research topics of 'Effect of partial melting parameters on the microstructures and critical current density of Bi-2212 thick films'. Together they form a unique fingerprint.

Cite this