TY - JOUR
T1 - Effect of energy density and feeding speed on micro-hole drilling in C/SiC composites by picosecond laser
AU - Liu, Yongsheng
AU - Wang, Chunhui
AU - Li, Weinan
AU - Zhang, Litong
AU - Yang, Xiaojun
AU - Cheng, Guanghua
AU - Zhang, Qing
PY - 2014/12
Y1 - 2014/12
N2 - The effect of energy density and feeding speed on micro-holes was investigated, which were machined in C/SiC composites by picosecond laser. Morphologies and elemental compositions of the machined holes in 2 mm and 3 mm thickness specimens were analyzed. The results indicated that both energy density and feeding speed had remarkable effect on the quality of micro-holes, especially on the exit side and cross-section of micro-holes. While the circularity of drilling holes on the entry side was affected by the energy density and feeding speed slightly. Additionally, the machining debris also played an important role in the quality of micro-holes. The micro-holes were consisted with three elements C, Si, and O, and those predominantly attributed to CC (sp2), CC (sp3) and SiO bonds. Moreover, the laser machining process was discussed, which was responsible for the formation of the debris.
AB - The effect of energy density and feeding speed on micro-holes was investigated, which were machined in C/SiC composites by picosecond laser. Morphologies and elemental compositions of the machined holes in 2 mm and 3 mm thickness specimens were analyzed. The results indicated that both energy density and feeding speed had remarkable effect on the quality of micro-holes, especially on the exit side and cross-section of micro-holes. While the circularity of drilling holes on the entry side was affected by the energy density and feeding speed slightly. Additionally, the machining debris also played an important role in the quality of micro-holes. The micro-holes were consisted with three elements C, Si, and O, and those predominantly attributed to CC (sp2), CC (sp3) and SiO bonds. Moreover, the laser machining process was discussed, which was responsible for the formation of the debris.
KW - Ceramic-matrix composites
KW - Laser processing
KW - Scanning electron microscopy (SEM)
KW - X-ray photoelectron spectroscopy (XPS)
UR - http://www.scopus.com/inward/record.url?scp=84937704075&partnerID=8YFLogxK
U2 - 10.1016/j.jmatprotec.2014.07.016
DO - 10.1016/j.jmatprotec.2014.07.016
M3 - 文章
AN - SCOPUS:84937704075
SN - 0924-0136
VL - 214
SP - 3131
EP - 3140
JO - Journal of Materials Processing Technology
JF - Journal of Materials Processing Technology
IS - 12
ER -