TY - GEN
T1 - Durable Ag-Coated Micro-Crack Velcro Electrode for Hi-Fi Bioelectric Signals in Hairy Areas
AU - Guo, Jun
AU - Fu, Kang
AU - Zhang, Zimo
AU - Bai, Ruiyu
AU - Wang, Xuanqi
AU - Xue, Kai
AU - Chen, Huazhen
AU - Li, Le
AU - Hu, Huijing
AU - Wang, Minghao
AU - Chang, Honglong
AU - Ji, Bowen
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper reports a conductive Velcro electrode with micro-cracks for the first time. The laser-induced micro-cracks increase the surface area of Velcro hooks and facilitate the adhesion of more silver particles. A cluster of Nylon-Ag hook are durable with repeated mechanical compression and multiple washing. After 100 times of compression, the plastic deformation is less than 23 μm (<10%). The impedance (@10 Hz) of the Velcro electrode is still 2.6% lower than the AgCl electrode after washing for 3 times. The resilient conductive hooks can effectively penetrate through thick hair for hi-fi bioelectric signal acquisition, compared with commercial AgCl electrodes.
AB - This paper reports a conductive Velcro electrode with micro-cracks for the first time. The laser-induced micro-cracks increase the surface area of Velcro hooks and facilitate the adhesion of more silver particles. A cluster of Nylon-Ag hook are durable with repeated mechanical compression and multiple washing. After 100 times of compression, the plastic deformation is less than 23 μm (<10%). The impedance (@10 Hz) of the Velcro electrode is still 2.6% lower than the AgCl electrode after washing for 3 times. The resilient conductive hooks can effectively penetrate through thick hair for hi-fi bioelectric signal acquisition, compared with commercial AgCl electrodes.
KW - Bioelectric signal acquisition
KW - Conductive Velcro electrode
KW - Micro-cracks
KW - Thick hair penetration
UR - http://www.scopus.com/inward/record.url?scp=105001663376&partnerID=8YFLogxK
U2 - 10.1109/MEMS61431.2025.10917605
DO - 10.1109/MEMS61431.2025.10917605
M3 - 会议稿件
AN - SCOPUS:105001663376
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 299
EP - 302
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -