Abstract
Vacuum diffusion bonding of stainless steel to copper was carried out at a temperature ranging from 830 to 950 °C under an axial pressure of 3 MPa for 60 min with three kinds of interlayer metals: tin-bronze (TB) foil, Au foil, and TB-Au composite interlayer. The results showed that the grain boundary wetting was formed within the steel adjacent to the interface due to the contact melting between TB and Au when TB-Au composite interlayer was used. The grain boundary wetting could occur at a relatively low temperature of 830 °C and becomes significant with the increase of temperature. The tensile strength of the joint with TB-Au was higher than that with TB or Au interlayer separately and could be 228 MPa at the joining temperature of 850 °C. Furthermore, the axial compression ratio of the specimen joined at 850 °C was approximately 1.2%. Therefore, a reliable and precise joining of stainless steel to copper could be realized by diffusion bonding with the TB-Au composite interlayer at a comparatively low temperature.
| Original language | English |
|---|---|
| Pages (from-to) | 33-37 |
| Number of pages | 5 |
| Journal | Journal of Materials Engineering and Performance |
| Volume | 21 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2012 |
Keywords
- contact melting
- diffusion bonding
- grain boundary wetting