TY - JOUR
T1 - Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method
AU - Gu, Junwei
AU - Lv, Zhaoyuan
AU - Wu, Yalan
AU - Guo, Yongqiang
AU - Tian, Lidong
AU - Qiu, Hua
AU - Li, Wanzheng
AU - Zhang, Qiuyu
N1 - Publisher Copyright:
© 2016 Elsevier Ltd
PY - 2017/3/1
Y1 - 2017/3/1
N2 - Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, THeat-resistance index (THRI) of 279 °C and glass transition temperature (Tg) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.
AB - Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, THeat-resistance index (THRI) of 279 °C and glass transition temperature (Tg) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.
KW - A. Polymer-matrix composites (PMCs)
KW - B. Thermal properties
KW - C. Electrospinning
KW - D. Compression moulding
UR - http://www.scopus.com/inward/record.url?scp=85007304599&partnerID=8YFLogxK
U2 - 10.1016/j.compositesa.2016.12.014
DO - 10.1016/j.compositesa.2016.12.014
M3 - 文章
AN - SCOPUS:85007304599
SN - 1359-835X
VL - 94
SP - 209
EP - 216
JO - Composites Part A: Applied Science and Manufacturing
JF - Composites Part A: Applied Science and Manufacturing
ER -