TY - GEN
T1 - Design of RF Micro-system Based on Multi-chip Stacking
AU - Zhao, Chao
AU - Hu, Mengjie
AU - Zhu, Zhenghu
AU - Yang, Cheng
AU - Wang, Zhikui
AU - Long, Xu
N1 - Publisher Copyright:
© The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.
PY - 2024
Y1 - 2024
N2 - With the continuous development of miniaturization of electronic equipment, the research and development of radio frequency micro-system has become increasingly popular. Multi-chip stacking is one of the key technologies of RF micro-system. The selection of stack structure will have a significant impact on the performance of the system. According to the requirements of RF micro-system, two kinds of chip-stack structures are adopted, and the stack structure is simulated and optimized. A frequency conversion channel is designed based on the chip-stack structures, which realizes the functions of amplification, mixing, amplitude control, power division and detection of 2–6 GHz RF signals. The key technology analysis and simulation of the system are carried out. The results show that the RF micro-system has the characteristics of small size, high integration and excellent RF performance.
AB - With the continuous development of miniaturization of electronic equipment, the research and development of radio frequency micro-system has become increasingly popular. Multi-chip stacking is one of the key technologies of RF micro-system. The selection of stack structure will have a significant impact on the performance of the system. According to the requirements of RF micro-system, two kinds of chip-stack structures are adopted, and the stack structure is simulated and optimized. A frequency conversion channel is designed based on the chip-stack structures, which realizes the functions of amplification, mixing, amplitude control, power division and detection of 2–6 GHz RF signals. The key technology analysis and simulation of the system are carried out. The results show that the RF micro-system has the characteristics of small size, high integration and excellent RF performance.
KW - Chip stacking
KW - Flip-chip
KW - Frequency conversion channel
KW - RF micro-system
UR - http://www.scopus.com/inward/record.url?scp=85184129923&partnerID=8YFLogxK
U2 - 10.1007/978-3-031-44947-5_82
DO - 10.1007/978-3-031-44947-5_82
M3 - 会议稿件
AN - SCOPUS:85184129923
SN - 9783031449468
T3 - Mechanisms and Machine Science
SP - 1073
EP - 1079
BT - Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2023—Volume 3
A2 - Li, Shaofan
PB - Springer Science and Business Media B.V.
T2 - 29th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2023
Y2 - 26 May 2023 through 29 May 2023
ER -