Design of A Microwave Multi-Channel T-R Module

Weiwei Guan; Ming Song; Guodong Liu; Haosheng Deng; Shigang Zhou

doi:10.1109/IMWS-AMP53428.2021.9643980

Design of A Microwave Multi-Channel T-R Module

Weiwei Guan, Ming Song, Guodong Liu, Haosheng Deng, Shigang Zhou

School of Electronics and Information

Beijing Institute of Long March Aerospace Vehicles

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

This article introduces a 48-channel T-R module used in a data-link phased-Array system, Realizing the highly integrated and miniaturized design of TR components. The key issues such as vertical interconnection of radio frequency signals, electromagnetic compatibility and heat dissipation in the K-band high-density assembly are solved.

Original language	English
Title of host publication	2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	344-345
Number of pages	2
ISBN (Electronic)	9781665428194
DOIs	https://doi.org/10.1109/IMWS-AMP53428.2021.9643980
State	Published - 2021
Event	2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021 - Chongqing, China Duration: 15 Nov 2021 → 17 Nov 2021

Publication series

Name	2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021

Conference

Conference	2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021
Country/Territory	China
City	Chongqing
Period	15/11/21 → 17/11/21

Keywords

k-band
Miniaturization
T-R module

Access to Document

10.1109/IMWS-AMP53428.2021.9643980

Cite this

Guan, W., Song, M., Liu, G., Deng, H., & Zhou, S. (2021). Design of A Microwave Multi-Channel T-R Module. In 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021 (pp. 344-345). (2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMWS-AMP53428.2021.9643980

Guan, Weiwei ; Song, Ming ; Liu, Guodong et al. / Design of A Microwave Multi-Channel T-R Module. 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 344-345 (2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021).

@inproceedings{d8f99991f5834eaaa4cbbdd42dae928e,

title = "Design of A Microwave Multi-Channel T-R Module",

abstract = "This article introduces a 48-channel T-R module used in a data-link phased-Array system, Realizing the highly integrated and miniaturized design of TR components. The key issues such as vertical interconnection of radio frequency signals, electromagnetic compatibility and heat dissipation in the K-band high-density assembly are solved.",

keywords = "k-band, Miniaturization, T-R module",

author = "Weiwei Guan and Ming Song and Guodong Liu and Haosheng Deng and Shigang Zhou",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021 ; Conference date: 15-11-2021 Through 17-11-2021",

year = "2021",

doi = "10.1109/IMWS-AMP53428.2021.9643980",

language = "英语",

series = "2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "344--345",

booktitle = "2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021",

}

Guan, W, Song, M, Liu, G, Deng, H & Zhou, S 2021, Design of A Microwave Multi-Channel T-R Module. in 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021. 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021, Institute of Electrical and Electronics Engineers Inc., pp. 344-345, 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021, Chongqing, China, 15/11/21. https://doi.org/10.1109/IMWS-AMP53428.2021.9643980

Design of A Microwave Multi-Channel T-R Module. / Guan, Weiwei; Song, Ming; Liu, Guodong et al.
2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 344-345 (2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Design of A Microwave Multi-Channel T-R Module

AU - Guan, Weiwei

AU - Song, Ming

AU - Liu, Guodong

AU - Deng, Haosheng

AU - Zhou, Shigang

PY - 2021

Y1 - 2021

N2 - This article introduces a 48-channel T-R module used in a data-link phased-Array system, Realizing the highly integrated and miniaturized design of TR components. The key issues such as vertical interconnection of radio frequency signals, electromagnetic compatibility and heat dissipation in the K-band high-density assembly are solved.

AB - This article introduces a 48-channel T-R module used in a data-link phased-Array system, Realizing the highly integrated and miniaturized design of TR components. The key issues such as vertical interconnection of radio frequency signals, electromagnetic compatibility and heat dissipation in the K-band high-density assembly are solved.

KW - k-band

KW - Miniaturization

KW - T-R module

UR - http://www.scopus.com/inward/record.url?scp=85124161523&partnerID=8YFLogxK

U2 - 10.1109/IMWS-AMP53428.2021.9643980

DO - 10.1109/IMWS-AMP53428.2021.9643980

M3 - 会议稿件

AN - SCOPUS:85124161523

T3 - 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021

SP - 344

EP - 345

BT - 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021

Y2 - 15 November 2021 through 17 November 2021

ER -

Guan W, Song M, Liu G, Deng H, Zhou S. Design of A Microwave Multi-Channel T-R Module. In 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 344-345. (2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021). doi: 10.1109/IMWS-AMP53428.2021.9643980

Design of A Microwave Multi-Channel T-R Module

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