Comparing internal stress in diamond-like carbon films with different structure

Peng Wang; Xia Wang; Tao Xu; Weimin Liu; Junyan Zhang

doi:10.1016/j.tsf.2007.02.069

Comparing internal stress in diamond-like carbon films with different structure

Peng Wang, Xia Wang, Tao Xu, Weimin Liu, Junyan Zhang

Research output: Contribution to journal › Article › peer-review

123 Scopus citations

Abstract

Diamond-like carbon (DLC) films with different structures were deposited on Si (100) and stainless steel substrates in a hybrid deposition system with Ar and CH₄ as the feedstocks. The effects of the bias voltage, Ti-interlayer, Ti functional gradient layer and Ti-doping on the internal stress in DLC films were investigated. The results show that the internal stress in DLC films arises from both the intrinsic stress generated during the film growth and the thermal stress generated due to the mismatching of the thermal expansion coefficient between the DLC films and the substrate materials. The intrinsic stress can be released through doping titanium element at the expense of reducing the sp³/sp² ratio. The thermal stress in DLC films can be decreased through introducing Ti-interlayer or Ti functional gradient layer. Noticeably, DLC films with very low internal stress deposited on stainless steel can be obtained through the combination of Ti-doping and Ti functional gradient layer.

Original language	English
Pages (from-to)	6899-6903
Number of pages	5
Journal	Thin Solid Films
Volume	515
Issue number	17
DOIs	https://doi.org/10.1016/j.tsf.2007.02.069
State	Published - Jun 2007
Externally published	Yes

Keywords

DLC films
Functional gradient
Internal stress
Ti-doping
Ti-interlayer

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10.1016/j.tsf.2007.02.069

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title = "Comparing internal stress in diamond-like carbon films with different structure",

abstract = "Diamond-like carbon (DLC) films with different structures were deposited on Si (100) and stainless steel substrates in a hybrid deposition system with Ar and CH4 as the feedstocks. The effects of the bias voltage, Ti-interlayer, Ti functional gradient layer and Ti-doping on the internal stress in DLC films were investigated. The results show that the internal stress in DLC films arises from both the intrinsic stress generated during the film growth and the thermal stress generated due to the mismatching of the thermal expansion coefficient between the DLC films and the substrate materials. The intrinsic stress can be released through doping titanium element at the expense of reducing the sp3/sp2 ratio. The thermal stress in DLC films can be decreased through introducing Ti-interlayer or Ti functional gradient layer. Noticeably, DLC films with very low internal stress deposited on stainless steel can be obtained through the combination of Ti-doping and Ti functional gradient layer.",

keywords = "DLC films, Functional gradient, Internal stress, Ti-doping, Ti-interlayer",

author = "Peng Wang and Xia Wang and Tao Xu and Weimin Liu and Junyan Zhang",

year = "2007",

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doi = "10.1016/j.tsf.2007.02.069",

language = "英语",

volume = "515",

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journal = "Thin Solid Films",

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T1 - Comparing internal stress in diamond-like carbon films with different structure

AU - Wang, Peng

AU - Wang, Xia

AU - Xu, Tao

AU - Liu, Weimin

AU - Zhang, Junyan

PY - 2007/6

Y1 - 2007/6

N2 - Diamond-like carbon (DLC) films with different structures were deposited on Si (100) and stainless steel substrates in a hybrid deposition system with Ar and CH4 as the feedstocks. The effects of the bias voltage, Ti-interlayer, Ti functional gradient layer and Ti-doping on the internal stress in DLC films were investigated. The results show that the internal stress in DLC films arises from both the intrinsic stress generated during the film growth and the thermal stress generated due to the mismatching of the thermal expansion coefficient between the DLC films and the substrate materials. The intrinsic stress can be released through doping titanium element at the expense of reducing the sp3/sp2 ratio. The thermal stress in DLC films can be decreased through introducing Ti-interlayer or Ti functional gradient layer. Noticeably, DLC films with very low internal stress deposited on stainless steel can be obtained through the combination of Ti-doping and Ti functional gradient layer.

AB - Diamond-like carbon (DLC) films with different structures were deposited on Si (100) and stainless steel substrates in a hybrid deposition system with Ar and CH4 as the feedstocks. The effects of the bias voltage, Ti-interlayer, Ti functional gradient layer and Ti-doping on the internal stress in DLC films were investigated. The results show that the internal stress in DLC films arises from both the intrinsic stress generated during the film growth and the thermal stress generated due to the mismatching of the thermal expansion coefficient between the DLC films and the substrate materials. The intrinsic stress can be released through doping titanium element at the expense of reducing the sp3/sp2 ratio. The thermal stress in DLC films can be decreased through introducing Ti-interlayer or Ti functional gradient layer. Noticeably, DLC films with very low internal stress deposited on stainless steel can be obtained through the combination of Ti-doping and Ti functional gradient layer.

KW - DLC films

KW - Functional gradient

KW - Internal stress

KW - Ti-doping

KW - Ti-interlayer

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DO - 10.1016/j.tsf.2007.02.069

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VL - 515

SP - 6899

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JO - Thin Solid Films

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ER -

Comparing internal stress in diamond-like carbon films with different structure

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Keywords

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