Atomic simulation of void location effect on the void growth in nickel-based single crystal

J. P. Wang, J. W. Liang, Z. X. Wen, Z. F. Yue

Research output: Contribution to journalArticlepeer-review

30 Scopus citations

Abstract

Void growth in metallic materials are strongly affected by local microstructure. The location of defect produces a great influence on the mechanical properties of material, especially if defect occurs at the interface. Considering the complex microstructure of nickel-based single crystal, the Ni, Ni 3 Al and Ni/Ni 3 Al interface model were established to analyze the expansion dynamics of void using molecular dynamics (MD) method. The expansion behavior of void shows that a/6〈1 1 2〉 Shockley partial dislocations initially nucleates on the free surface of void during the stretching of Ni and Ni 3 Al model. Whereas, dislocations nucleate from the interface of Ni/Ni 3 Al interface model. Evolution of void suggested that the plasticity deformation is dominated by movable Shockley partial dislocations and immovable Stair-rod dislocations. Void size effect analysis revealed that the larger void radius is, the smaller yield stress and Young's modulus are. The mechanical properties of Ni/Ni 3 Al interface model were controlled by the interaction between void and interface.

Original languageEnglish
Pages (from-to)245-255
Number of pages11
JournalComputational Materials Science
Volume160
DOIs
StatePublished - 1 Apr 2019

Keywords

  • Dislocation nucleation
  • Molecular dynamics (MD) method
  • Ni/Ni Al interface
  • Shockley partial dislocation
  • Void growth

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