A Study on the technical method of drilling micro holes on new CMC-SiC with femtosecond laser

Wang Feng, Jian Jun Luo, Ming Li, Yue Deng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

To solve the difficulties of processing micro holes on the CMC-SiC, femtosecond laser was used as the drilling tool in this paper. And a new type of laser beam scanning module was studied. The study confirms the feasibility of finishing the processing of micro holes whose diameter is less than 2mm on the new CMC-SiC. And the preliminary optimization of processing parameters is completed. According to the experimental results, the important factors affecting the quality of the micro holes were analyzed, and the factors are the processing power and the scanning speed. The results also show that the femtosecond laser processing technology can solve the difficulties of drilling mirco holes on the new CMC-SiC in our country's aerospace field.

Original languageEnglish
Title of host publicationVehicle, Mechatronics and Information Technologies II
PublisherTrans Tech Publications
Pages3924-3930
Number of pages7
ISBN (Print)9783038350606
DOIs
StatePublished - 2014
EventInternational Conference on Vehicle and Mechanical Engineering and Information Technology, VMEIT 2014 - Beijing, China
Duration: 19 Feb 201420 Feb 2014

Publication series

NameApplied Mechanics and Materials
Volume543-547
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

ConferenceInternational Conference on Vehicle and Mechanical Engineering and Information Technology, VMEIT 2014
Country/TerritoryChina
CityBeijing
Period19/02/1420/02/14

Keywords

  • CMC-SiC
  • Femtosecond laser
  • Laser processing
  • Micro holes
  • Taper

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