A statistical mechanics model to predict electromigration induced damage and void growth in solder interconnects

Yuexing Wang, Yao Yao, Leon M. Keer

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

Electromigration is an irreversible mass diffusion process with damage accumulation in microelectronic materials and components under high current density. Based on experimental observations, cotton type voids dominate the electromigration damage accumulation prior to cracking in the solder interconnect. To clarify the damage evolution process corresponding to cotton type void growth, a statistical model is proposed to predict the stochastic characteristic of void growth under high current density. An analytical solution of the cotton type void volume growth over time is obtained. The synchronous electromigration induced damage accumulation is predicted by combining the statistical void growth and the entropy increment. The electromigration induced damage evolution in solder joints is developed and applied to verify the tensile strength deterioration of solder joints due to electromigration. The predictions agree well with the experimental results.

Original languageEnglish
Pages (from-to)195-204
Number of pages10
JournalPhysica A: Statistical Mechanics and its Applications
Volume468
DOIs
StatePublished - 15 Feb 2017

Keywords

  • Damage
  • Electromigration
  • Entropy
  • Solder
  • Statistic model
  • Voids

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