TY - GEN
T1 - A Novel SESC Microstructure to Realize Various Spontaneously Liquid Spreading Properties
AU - Hong, Wen
AU - Tang, Longjun
AU - Ji, Bowen
AU - Sun, Wenxi
AU - Yang, Bin
AU - Wang, Xiaolin
AU - Liu, Jingquan
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - We report design and fabrication of a novel microstructure with both sharp edge and sharp corner (SESC) in its topography, which can be tailored to achieve various liquid spreading properties. The sharp edge of the SESC microstructure can hinder liquid spreading in one direction, while the sharp corner can enhance liquid spreading in another direction. By utilizing the two opposite effects of the sharp edge and the sharp corner, two different types of anisotropic wetting properties are demonstrated, including bidirectional water spreading on a 2-D SESC microstructure and unidirectional water spreading on a 3-D SESC microstructure. On the fabricated 2-D SESC microstructure, contact angle difference in parallel and perpendicular direction can reach 93.8°, which is the highest in published works.
AB - We report design and fabrication of a novel microstructure with both sharp edge and sharp corner (SESC) in its topography, which can be tailored to achieve various liquid spreading properties. The sharp edge of the SESC microstructure can hinder liquid spreading in one direction, while the sharp corner can enhance liquid spreading in another direction. By utilizing the two opposite effects of the sharp edge and the sharp corner, two different types of anisotropic wetting properties are demonstrated, including bidirectional water spreading on a 2-D SESC microstructure and unidirectional water spreading on a 3-D SESC microstructure. On the fabricated 2-D SESC microstructure, contact angle difference in parallel and perpendicular direction can reach 93.8°, which is the highest in published works.
UR - http://www.scopus.com/inward/record.url?scp=85074344888&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2019.8870690
DO - 10.1109/MEMSYS.2019.8870690
M3 - 会议稿件
AN - SCOPUS:85074344888
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 400
EP - 403
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -