Abstract
A novel powder preparation method, semi-solid powder preparation technology, has been developed, which consist of two processes, i.e., the formation of globular crystals from the melt using a semi-solid processing, and the separation of the globular crystals from the melt. An significant difference with the traditional powder preparation technology is that the powder prepared by this method is formed directly from the melt via a semi-solid process, which eliminates oxidation of the powder. Moreover, it is easy to self-form a low-melting-point alloy film on the powder surface, which avoids the use of an additional adhesive during the powder sintering process, and minimizes the contamination induced by the external additions, and improves the quality of sintered P/M parts. Experiments with a Sn-15wt.%Pb alloy show that this approach can generate high quality, single crystal powders without defects such as non-metallic inclusions, shrinkage, etc. Detailed results and analyses are presented and discussed.
Original language | English |
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Pages | 777-786 |
Number of pages | 10 |
State | Published - 2004 |
Event | 8th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2004 - Limassol, Cyprus Duration: 21 Sep 2004 → 23 Sep 2004 |
Conference
Conference | 8th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2004 |
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Country/Territory | Cyprus |
City | Limassol |
Period | 21/09/04 → 23/09/04 |
Keywords
- Powder fabrication technology
- Semi-solid process
- Single crystal powder
- Sn-15%Pb alloy