@inproceedings{b58464c8ba024f818a82e0636f285101,
title = "A novel packaging stress isolation structure for SOI based MEMS gyroscopes",
abstract = "In this paper, we propose a packaging stress isolation structure for the silicon-on-insulator (SOI) based microelectromechanical systems (MEMS) gyroscopes. The structure is designed on the handle layer and consists of a circular disk, eight 'L-shape' elastic beams, and a support frame. The disk is located on the center of the die and occupies less than 5 percent of the whole handle layer area which can reduce the packaging stress and avoid the uneven stress distribution. The elastic beams are orthogonally distributed along the x and y axis connecting the disk with the support frame, which can further suppress stress evenly. The results reveal that the packaging stress transferred to the gyroscope is reduced by two orders of magnitude.",
keywords = "gyroscope, packaging, stress isolation",
author = "Yongcun Hao and Weizheng Yuan and Jianbing Xie and Honglong Chang",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 15th IEEE Sensors Conference, SENSORS 2016 ; Conference date: 30-10-2016 Through 02-11-2016",
year = "2016",
month = jan,
day = "5",
doi = "10.1109/ICSENS.2016.7808649",
language = "英语",
series = "Proceedings of IEEE Sensors",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "IEEE Sensors, SENSORS 2016 - Proceedings",
}