TY - GEN
T1 - A mode localization based resonant MEMS tilt sensor with a linear measurement range of 360°
AU - Li, Boyang
AU - Zhang, Hemin
AU - Zhong, Jiming
AU - Chang, Honglong
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/2/26
Y1 - 2016/2/26
N2 - This paper reports a resonant MEMS tilt sensor based on mode localization phenomenon for the first time. The tilt sensor consists of two mode localization based accelerometers which are perpendicular to each other. The input tilt angle will cause dramatic changes of the mode shape of both accelerometers. Furthermore, the linear measurement range is extended to a full-range of [-90°, 90°] by alternatively measuring the shifts of the two amplitude ratios with a phase difference of 90°. Current test results show that the relative sensitivity based on the amplitude ratio is averagely 169 times higher than that of the frequency with a non-linearity of less than 4.5% in the range of [-90°, 90°]. The outputs of the input tilt angle (θ) from [90°, 270°] and [-90°, 90°] are axial symmetry about θ = 90°, so it is easy to extend the linear measurement range to 360°.
AB - This paper reports a resonant MEMS tilt sensor based on mode localization phenomenon for the first time. The tilt sensor consists of two mode localization based accelerometers which are perpendicular to each other. The input tilt angle will cause dramatic changes of the mode shape of both accelerometers. Furthermore, the linear measurement range is extended to a full-range of [-90°, 90°] by alternatively measuring the shifts of the two amplitude ratios with a phase difference of 90°. Current test results show that the relative sensitivity based on the amplitude ratio is averagely 169 times higher than that of the frequency with a non-linearity of less than 4.5% in the range of [-90°, 90°]. The outputs of the input tilt angle (θ) from [90°, 270°] and [-90°, 90°] are axial symmetry about θ = 90°, so it is easy to extend the linear measurement range to 360°.
UR - http://www.scopus.com/inward/record.url?scp=84971016362&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2016.7421786
DO - 10.1109/MEMSYS.2016.7421786
M3 - 会议稿件
AN - SCOPUS:84971016362
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 938
EP - 941
BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Y2 - 24 January 2016 through 28 January 2016
ER -