A micromechanical analysis to the elasto-viscoplastic behavior of solder alloys

Lu Liu, Yao Yao, Tao Zeng

Research output: Contribution to journalArticlepeer-review

20 Scopus citations

Abstract

A small strain multi-scale elasto-plastic self-consistent constitutive model is developed to describe the rate and temperature dependent behavior of solder alloys. In the extended model, a modified Voce hardening law is proposed to describe the change of hardening rate as a function of accumulated shear strain. The developed model has been incorporated into finite element analysis to obtain the macroscopic behavior of polycrystalline materials. The stress updating algorithms of both microscopic and macroscopic scales are presented. The effect of grain shape on macroscopic behavior is investigated. The proposed model is verified with the Taylor factor and the experimental data of Sn-3.0Ag-0.5Cu and Sn-0.7Cu solder alloys at different temperatures and strain rates. In general, the numerical results can fit the experimental data with reasonable accuracy.

Original languageEnglish
Pages (from-to)211-220
Number of pages10
JournalInternational Journal of Solids and Structures
Volume159
DOIs
StatePublished - 1 Mar 2019

Keywords

  • Elasto-plastic self-consistent model
  • Micromechanics
  • Polycrystalline
  • Rate-dependent
  • Solder alloys

Fingerprint

Dive into the research topics of 'A micromechanical analysis to the elasto-viscoplastic behavior of solder alloys'. Together they form a unique fingerprint.

Cite this