TY - GEN
T1 - A High-Resolution Mass Sensor Based on Two Thermal Piezoresistive Self-Sustained Resonators Coupled via An Arching Membrane
AU - Quan, Aojie
AU - Zhang, Hemin
AU - Wang, Chen
AU - Burssens, Jan Willem
AU - Wang, Linlin
AU - Wang, Chenxi
AU - Cooman, Michel De
AU - Kraft, Michael
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper reports a mode-localized mass sensor based on two thermal-piezoresistive self-sustained resonators coupled by an arching mechanical membrane coupler. Sensitivities of the mass sensors based on coupled resonators with amplitude ratio readout depends on a low coupling factor. To lower the coupling stiffness between the two thermal-piezoresistive coupling resonators, an arching membrane coupler with thickness between 1 m to 8 m was fabricated underneath the coupling area of the two resonators, based on the aspect ratio dependent etching (ARDE) effect. The experimental results indicated that the sensitivity and resolution of the newly designed mass sensor with the arching membrane coupler were increased by 20 and 10 times, respectively, compared to the state-of-the-art.
AB - This paper reports a mode-localized mass sensor based on two thermal-piezoresistive self-sustained resonators coupled by an arching mechanical membrane coupler. Sensitivities of the mass sensors based on coupled resonators with amplitude ratio readout depends on a low coupling factor. To lower the coupling stiffness between the two thermal-piezoresistive coupling resonators, an arching membrane coupler with thickness between 1 m to 8 m was fabricated underneath the coupling area of the two resonators, based on the aspect ratio dependent etching (ARDE) effect. The experimental results indicated that the sensitivity and resolution of the newly designed mass sensor with the arching membrane coupler were increased by 20 and 10 times, respectively, compared to the state-of-the-art.
KW - aspect ratio dependent etching effect
KW - Mass sensor
KW - mode localization
KW - self-oscillation
KW - thermal-piezoresistive
UR - http://www.scopus.com/inward/record.url?scp=85126391857&partnerID=8YFLogxK
U2 - 10.1109/MEMS51670.2022.9699769
DO - 10.1109/MEMS51670.2022.9699769
M3 - 会议稿件
AN - SCOPUS:85126391857
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 856
EP - 859
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -