复合材料壳体固化过程温度场数值分析

In the curing process of the composite case,the non-uniform temperature field and the non-uniform curing degree field would lead to defects such as layer detachment. In this work,a thermal-chemical coupling model is established,in the model effects of resin curing reaction kinetics,hot air flow characteristics in the oven,composite and auxiliary material's physical parameters time-varying are considered. The temperature field evolution during curing process is studied numerically with the model.The results show that: the numerical prediction has a small error (<1.5%) respect to experimental results,which indicates that the model can predict the distribution of temperature during the curing process accurately; The reaction heat nearly has no effect on the case curing process in this work, as no exothermic peak was observed; the minimum temperature points are at the pro-contact region of the metal rings at forward and aft domes.