基于元件降额设计的温度步进强化试验剖面设计

Translated title of the contribution: Design of temperature stepping enhancement test profile based on component derating design

Xiaofeng Xue, Guangduo Xu, Yunwen Feng, Jiaqi Liu, Tao Gao, Shixi Guo, Wei Zhang

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Aiming at the problems of low efficiency and high cost of the enhanced test profile, a design framework for the temperature enhancement test profile of a certain missile electronics is proposed. Combined with the product reliability block diagram, the failure logic analysis of the test object is carried out. The step design method based on component derating (CD-SDM) optimizes the step size and shortens the test time, and the deterministic analysis method based on finite element simulation is used to obtain the working limit and the failure limit estimation, which reduce the influence of the working margin between the limits when the step size is divided and realize the optimization of step size, test time and other elements. Taking a high-temperature stepping test of a certain missile electronics as an example to verify the proposed method, the experimental results show that the temperature strengthening test profile obtained can be shortened by at least 13.33% in test time compared with the traditional methods, and the number of detection times is reduced by 1/4 compared with the traditional methods, which optimizes the problem of low efficiency and high cost of the current reliability enhancement test profile design for missile electronics.

Translated title of the contributionDesign of temperature stepping enhancement test profile based on component derating design
Original languageChinese (Traditional)
Pages (from-to)4073-4083
Number of pages11
JournalXi Tong Gong Cheng Yu Dian Zi Ji Shu/Systems Engineering and Electronics
Volume45
Issue number12
DOIs
StatePublished - Dec 2023

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