TY - JOUR
T1 - Vacancy-Triggered Active Modulation on the Thermal Response of Interfacial Polarization Enables Highly Stable Broad-Temperature Electromagnetic Wave Absorption
AU - Lu, Xiaoke
AU - Li, Xin
AU - Wei, Kun
AU - Yang, Ziwei
AU - Gao, Weizhuo
AU - Xu, Hongcheng
AU - Zhang, Chuanyu
AU - Xu, Hailong
AU - Wu, Hongjing
AU - Wei, Xueyong
N1 - Publisher Copyright:
© 2025 Wiley-VCH GmbH.
PY - 2026/2/5
Y1 - 2026/2/5
N2 - Maintaining stable electromagnetic wave absorption across wide temperature ranges hinges on utilizing the negative temperature response of interfacial polarization loss to compensate for increasing conductive loss at elevated temperatures. But the response amplitude is recognized as an uncontrollable parameter that passively relies on the temperature variation range, hindering the development of effective compensation. Herein, a strategy is proposed to actively amplify the temperature response amplitude of interfacial polarization through vacancy-mediated thermal reconfiguration of interfacial charges. In SiC@ZnIn2S4 heterostructures, controlled sulfur vacancy engineering enhances mobile interfacial charge density and thermal responsiveness, significantly enlarges interfacial charge density differentials before/after thermal excitation, achieving thermal response amplification of interfacial polarization. This active amplification mechanism achieves 93% compensation efficiency for excessive conductive loss during heating—a 65% improvement over passive systems. Consequently, optimized dynamic impedance matching maintains reflection loss below −10 dB in X-band from room temperature to 300 °C. This work elucidates the mechanism of vacancy-modulated interfacial charge dynamics via in situ characterization and multimodal calculations, while resolving the persistent challenge of temperature-passive-limited polarization response. The established paradigm of “vacancy-triggered active modulation on the thermal response of interfacial polarization” provides a readily generalizable design framework for wide-temperature electromagnetic functional materials.
AB - Maintaining stable electromagnetic wave absorption across wide temperature ranges hinges on utilizing the negative temperature response of interfacial polarization loss to compensate for increasing conductive loss at elevated temperatures. But the response amplitude is recognized as an uncontrollable parameter that passively relies on the temperature variation range, hindering the development of effective compensation. Herein, a strategy is proposed to actively amplify the temperature response amplitude of interfacial polarization through vacancy-mediated thermal reconfiguration of interfacial charges. In SiC@ZnIn2S4 heterostructures, controlled sulfur vacancy engineering enhances mobile interfacial charge density and thermal responsiveness, significantly enlarges interfacial charge density differentials before/after thermal excitation, achieving thermal response amplification of interfacial polarization. This active amplification mechanism achieves 93% compensation efficiency for excessive conductive loss during heating—a 65% improvement over passive systems. Consequently, optimized dynamic impedance matching maintains reflection loss below −10 dB in X-band from room temperature to 300 °C. This work elucidates the mechanism of vacancy-modulated interfacial charge dynamics via in situ characterization and multimodal calculations, while resolving the persistent challenge of temperature-passive-limited polarization response. The established paradigm of “vacancy-triggered active modulation on the thermal response of interfacial polarization” provides a readily generalizable design framework for wide-temperature electromagnetic functional materials.
KW - broad-temperature electromagnetic absorption
KW - charge thermal reconfiguration
KW - polarization
KW - vacancy engineering
UR - https://www.scopus.com/pages/publications/105015381861
U2 - 10.1002/adfm.202518206
DO - 10.1002/adfm.202518206
M3 - 文章
AN - SCOPUS:105015381861
SN - 1616-301X
VL - 36
JO - Advanced Functional Materials
JF - Advanced Functional Materials
IS - 11
M1 - e18206
ER -