The thermal properties and cure kinetics of polytriazole resin modified by 4,4-bis(azidomethyl) biphenyl

4,4-Bis(azidomethyl)biphenyl (BAMBP) was employed to modify the polytriazole resin. The thermal properties and cure kinetics of the modified polytriazole resin were investigated using differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. Results indicate that BAMBP can promote the curing reaction and decrease the curing reaction temperature but cannot change the cure reaction mechanism. The highest glass transition temperature of modified polytriazole resin can be obtained with 5 wt% BAMBP at 213.2°C. Furthermore, the excellent solubility characteristics of BAMBP in polytriazole allows for fabricating T700 carbon fiber/polytriazole composites, which makes polytriazole one of the candidate resins cured at a lower temperature but used at a higher temperature.