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The effect of grinding processing parameters on aspheric small-scale waviness

  • Qiancai Wei
  • , Lian Zhou
  • , Xianhua Chen
  • , Jie Li
  • , Qinghua Zhang
  • , Jian Wang
  • China Academy of Engineering Physics

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

摘要

Small scale waviness of aspheric surface inevitably occurs when grinding aspheric surface with grating parallel grinding technology, so aiming at the problem of waviness amplitude and uniformity, this paper theoretically analyses the relationship between grinding processing parameters and aspheric waviness, and designs a single factor experiment to verify the influence of grinding processing parameters on aspheric surface waviness. The processing parameters are determined to minimize the waviness amplitude. Considering the problem of uniformity of waviness, according to the influence of grinding force on uniformity of aspheric waviness in grinding process, down-grinding grating parallel grinding method and up-grinding grating parallel grinding method are used. Experiments verify that down-grinding grating parallel grinding method is the best method to get most uniformity small-scale waviness of aspheric surface. The minimum amplitude is 0.5μm∼1.5μm.

源语言英语
主期刊名AOPC 2019
主期刊副标题AI in Optics and Photonics
编辑John Greivenkamp, Jun Tanida, Yadong Jiang, Haimei Gong, Jin Lu, Dong Liu
出版商SPIE
ISBN(电子版)9781510634565
DOI
出版状态已出版 - 2019
已对外发布
活动Applied Optics and Photonics China 2019: AI in Optics and Photonics, AOPC 2019 - Beijing, 中国
期限: 7 7月 20199 7月 2019

出版系列

姓名Proceedings of SPIE - The International Society for Optical Engineering
11342
ISSN(印刷版)0277-786X
ISSN(电子版)1996-756X

会议

会议Applied Optics and Photonics China 2019: AI in Optics and Photonics, AOPC 2019
国家/地区中国
Beijing
时期7/07/199/07/19

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