Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy

The directional solidification process of ternary Ag_42.4Cu_21.6Sb₃₆ eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu₂Sb) + ε(Ag₃Sb) + Sb) eutectic morphology evolves from "lamellar (θ + ε) plus fibrous (Sb)" structure into "(θ + Sb) fibres in continuous ε matrix" structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag_42.4Cu_21.6Sb₃₆ alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.