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Supra-biomimetic Impact-Resistant Composites via Harnessing Macro–Microscale Competition

  • Miao Lei
  • , Mengqi Sun
  • , Qixuan Zhu
  • , Zihan Hao
  • , Dehua Tan
  • , Chaohui Wu
  • , Yueying Yang
  • , Chaohong Zhang
  • , Xuewen Wang
  • , Wei Huang
  • , Qianbo Lu
  • Northwestern Polytechnical University Xian
  • Sun Yat-Sen University

科研成果: 期刊稿件文章同行评审

摘要

Natural biomaterials achieve exceptional mechanical performance through multi-level hierarchical architectures, yet replicating or surpassing such topological control and multiscale synergy in synthetic hydrogels remains challenging. A key obstacle is the often-overlooked macro–microscale competition mechanism, where macroscopic reinforcement can conflict with finer-scale energy-dissipation pathways. Here, we overcome this limitation by embedding a 3-dimensionally printed gradient-twisted plywood (GT) framework into a hierarchically anisotropic (HA) hydrogel matrix, creating a topologically controllable supra-biomimetic composite (GT-HA composite). A supra-biomimetic design strategy is employed to regulate the macro–microscale competition, wherein the GT framework is expressly designed to coordinate macroscale stress guidance and crack deflection with micrometer-, nanometer-, and molecular-scale dissipation pathways. This coordinated multiscale dissipation endows composites with superior impact resistance. The GT-HA composite attenuates up to 88% of impact force at a low velocity and achieves a compressive strength of 183.57 MPa at a large strain rate of around 4,000 s−1 while maintaining long-term stability (<5% decay over 35 d). Notably, the fabrication process is compatible with integrated circuit/microelectromechanical system technologies, allowing wafer-level integration that effectively protects high-value devices such as processor dies and flexible circuits under high-speed impact. This work establishes a scalable strategy for designing ultra-impact-resistant materials by actively harnessing macro–micro competition, with promising applications in embodied intelligence, aerospace, and advanced electronics protection.

源语言英语
文章编号1358
期刊Research
9
DOI
出版状态已出版 - 1月 2026

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