Special issue on thermodynamics, flow, and heat transfer in MEMS

The special issue of the Journal of Electronic Packaging focuses on thermodynamics, flow, and heat transfer in microelectromechanical systems (MEMS) equipment. Thermodynamics, fluid flow, and heat transfer are important physical processes in advanced MEMS and affiliated parts. A better understanding of the mechanisms of thermodynamics, fluid mechanics, and heat transfer in MEMS is needed for advanced MEMS thermal management. MEMS thermal management demands high heat transfer coefficient, low pressure drop penalty, and low load-driven temperature nonuniformity. The articles published in this special issue address a variety of topics, including enhancement of single-phase cooling, analytic and numerical models from microchannel heat sink level to system level, development of three-dimensional multicavity microprocessor chip stacks, and a three-stage design approach for microchannel systems of multicore processors.