TY - GEN
T1 - Research of mutual radiation impedance effect on surface vibration velocity distribution
AU - Li, Daojiang
AU - Yi, Yan
AU - Shi, Wentao
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/12/29
Y1 - 2017/12/29
N2 - Based on the lumped parameter theory of piezoelectric transducer, the mathematical relationship between mutual radiation impedance and surface vibration velocity distribution of the array element is established, and then the simulation experiments were carried out for a 5×5 planar array. The simulation results show that the influence of amplitude and phase caused by mutual radiation impedance presents the features of oscillation curves in the condition of low frequency, small array element distance and large array element number. Mutual radiation impedance effect on surface vibration velocity distribution should be controlled in the large emission array design.
AB - Based on the lumped parameter theory of piezoelectric transducer, the mathematical relationship between mutual radiation impedance and surface vibration velocity distribution of the array element is established, and then the simulation experiments were carried out for a 5×5 planar array. The simulation results show that the influence of amplitude and phase caused by mutual radiation impedance presents the features of oscillation curves in the condition of low frequency, small array element distance and large array element number. Mutual radiation impedance effect on surface vibration velocity distribution should be controlled in the large emission array design.
KW - lumped parameter theory
KW - mutual radiation impedance
KW - piezoelectric transducer
KW - simulation experiments
KW - vibration velocity
UR - https://www.scopus.com/pages/publications/85049189704
U2 - 10.1109/ICSPCC.2017.8242598
DO - 10.1109/ICSPCC.2017.8242598
M3 - 会议稿件
AN - SCOPUS:85049189704
T3 - 2017 IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2017
SP - 1
EP - 6
BT - 2017 IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2017
Y2 - 22 October 2017 through 25 October 2017
ER -