Parametric Modeling Analysis and Lifetime Prediction of Large-Size Conductive Adhesive Bonding Layers

During the use of electronic devices, the thermal cycling experienced can impose enormous alternating stress cycles on the chip adhesive layers, which can accumulate over time to cause fatigue cracks, leading to the failure of the adhesive layers. To accurately and rapidly simulate the effects of thermal cycling on the chip adhesive layers, this paper adopts a parametric simulation-based approach, establishing a set of physical modeling methods for thermal cycle fatigue failure of chip adhesive structures. Through the secondary development function of Abaqus-Python, this study parametrically processes various physical variables that affect the reliability and lifetime of chip adhesive structures, allowing the model to account for changes in different working environments, stress states, and material parameters. This method, which combines numerical simulation technology and parametric modeling, can accurately predict the thermal cycling fatigue failure of chip adhesive layers under various working conditions and stress conditions. By establishing a simulation model that approximates actual working conditions, this method is expected to guide engineering practice, improving the reliability and stability of chip adhesive structures.