跳到主要导航 跳到搜索 跳到主要内容

Open Framework Design for Electronic Virtual Simulation Experiments With Unity3D

  • Chengkai Tang
  • , Songnian Zhang
  • , Lingling Zhang
  • , Zesheng Dan
  • , Xunbin Zhou
  • , Chenyu Wang
  • Northwestern Polytechnical University Xian

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

With the continuous development of virtual simulation technology, the role of electronic virtual simulation experiments in the teaching of electronic disciplines and scientific research work is also increasingly important.It has become an important issue to synthesize various technologies to develop a scalable and highly reusable framework for the development of virtual simulation experiments in electronics. In this paper, we propose a Unity3D-based virtual simulation open framework experimental design for electronic major categories, and put forward a framework hierarchical architecture model that contains three layers: the foundation layer, the communication layer, and the application layer, to realize the modularity, hierarchicality, and scalability of the virtual simulation experimental framework.Finally, this paper carries out the development of virtual simulation experiments in electronics based on the framework, which verifies the feasibility and scalability of the framework.

源语言英语
主期刊名2024 IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2024
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798350366556
DOI
出版状态已出版 - 2024
活动14th IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2024 - Hybrid, Bali, 印度尼西亚
期限: 19 8月 202422 8月 2024

出版系列

姓名2024 IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2024

会议

会议14th IEEE International Conference on Signal Processing, Communications and Computing, ICSPCC 2024
国家/地区印度尼西亚
Hybrid, Bali
时期19/08/2422/08/24

指纹

探究 'Open Framework Design for Electronic Virtual Simulation Experiments With Unity3D' 的科研主题。它们共同构成独一无二的指纹。

引用此