TY - JOUR
T1 - Numerical investigation of film cooling performance of a thin-wall thermal shield with disturbing pin fins
AU - Li, Yifan
AU - Ye, Lin
AU - Liang, Xiyuan
AU - Liu, Cunliang
AU - Zhai, Yingni
N1 - Publisher Copyright:
© 2026 Elsevier Inc.
PY - 2026/6
Y1 - 2026/6
N2 - For thin-wall heat shields in afterburner chambers, this study proposes an improved design by adding pin fins upstream of the film-cooling holes on the coolant side. This addresses the limitation of using inclined or shaped holes to enhance cooling. Numerical simulations were used to investigate the effects of pin fin height on the film hole exit momentum, film attachment, coolant-side convective heat transfer, and overall cooling effectiveness. The results show that when the pin fin height is less than 5 mm, downwash at the fin base and tip vortices deflect the coolant flow, enhancing the vertical momentum component at the hole exit. This increased vertical momentum causes the coolant jet to penetrate deeper into the mainstream, leading to premature liftoff and deteriorating film attachment, thereby reducing local and overall film-cooling efficiency. When the pin fin height exceeds 5 mm, the exit momentum decreases, the film attachment improves, and the convective heat transfer is enhanced. Consequently, the overall cooling effectiveness increases. The simulations indicate that the flat-spoiler shield can achieve a maximum 13.03% increase in overall cooling efficiency and a 39.72% increase in coolant-side convective heat transfer, outperforming flat heat shields of the same weight. The results show that the improved structure reduces flow losses and enhances heat protection without a significant weight penalty. This study demonstrates that the flat–pin fin heat shield is a highly efficient, lightweight design capable of improving thin-wall shield cooling under demanding thermofluidic conditions.
AB - For thin-wall heat shields in afterburner chambers, this study proposes an improved design by adding pin fins upstream of the film-cooling holes on the coolant side. This addresses the limitation of using inclined or shaped holes to enhance cooling. Numerical simulations were used to investigate the effects of pin fin height on the film hole exit momentum, film attachment, coolant-side convective heat transfer, and overall cooling effectiveness. The results show that when the pin fin height is less than 5 mm, downwash at the fin base and tip vortices deflect the coolant flow, enhancing the vertical momentum component at the hole exit. This increased vertical momentum causes the coolant jet to penetrate deeper into the mainstream, leading to premature liftoff and deteriorating film attachment, thereby reducing local and overall film-cooling efficiency. When the pin fin height exceeds 5 mm, the exit momentum decreases, the film attachment improves, and the convective heat transfer is enhanced. Consequently, the overall cooling effectiveness increases. The simulations indicate that the flat-spoiler shield can achieve a maximum 13.03% increase in overall cooling efficiency and a 39.72% increase in coolant-side convective heat transfer, outperforming flat heat shields of the same weight. The results show that the improved structure reduces flow losses and enhances heat protection without a significant weight penalty. This study demonstrates that the flat–pin fin heat shield is a highly efficient, lightweight design capable of improving thin-wall shield cooling under demanding thermofluidic conditions.
KW - Convective heat transfer coefficient
KW - Cooling efficiency
KW - Film cooling
KW - Heat shield
KW - Pin fin
UR - https://www.scopus.com/pages/publications/105036043094
U2 - 10.1016/j.ijheatfluidflow.2026.110433
DO - 10.1016/j.ijheatfluidflow.2026.110433
M3 - 文章
AN - SCOPUS:105036043094
SN - 0142-727X
VL - 120
JO - International Journal of Heat and Fluid Flow
JF - International Journal of Heat and Fluid Flow
M1 - 110433
ER -