Modeling and Simulation of Voids in Composite Tape Winding Process Based on Domain Superposition Technique

The tape winding technology is an effective way to fabricate rotationally composite materials. Nevertheless, some inevitable defects will seriously influence the performance of winding products. One of the crucial ways to identify the quality of fiber-reinforced composite material products is examining its void content. Significant improvement in products’ mechanical properties can be achieved by minimizing the void defect. Two methods were applied in this study, finite element analysis and experimental testing, respectively, to investigate the mechanism of how void forming in composite tape winding processing. Based on the theories of interlayer intimate contact and Domain Superposition Technique (DST), a three-dimensional model of prepreg tape void with SolidWorks has been modeled in this paper. Whereafter, ABAQUS simulation software was used to simulate the void content change with pressure and temperature. Finally, a series of experiments were performed to determine the accuracy of the model-based predictions. The results showed that the model is effective for predicting the void content in the composite tape winding process.