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Microfabricated SOI pressure sensor using dynamically balanced lateral resonator

  • Sen Ren
  • , Weizheng Yuan
  • , Xiaodong Sun
  • , Jinjun Deng
  • , Dayong Qiao
  • , Chengyu Jiang
  • Northwestern Polytechnical University Xian

科研成果: 书/报告/会议事项章节会议稿件同行评审

2 引用 (Scopus)

摘要

A resonant pressure sensor using a dynamically balanced lateral resonator is presented, which employs differential electrostatic comb structure for linear driving and sensing. The sensor is successfully microfabricated through a simple yet reliable micromachining process based on a commercially available silicon-on-insulator wafer with only two masks. Special anchor structure is developed to suppress the vertical position shift of the resonator when the diaphragm deflects, which using suspended connecting trusses to attach the stress-sensitive beam ends of the resonator. The sensor chip is mounted into a custom 16-pin Kovar package with epoxy resin for preliminary measurements. Testing results show that the resonator has a fundamental resonant frequency of 34.17 kHz, and the quality factor is about 1253 at atmospheric pressure, which rises to above 50 000 below 5 Pa. Over the pressure range of 100-380 kPa, the static pressure sensitivity is approximately 10.17 Hz/kPa, with the nonlinearity of 0.02%FS, the hysteresis error of 0.05%FS, and the repeatability error of 0.17%FS.

源语言英语
主期刊名9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
出版商Institute of Electrical and Electronics Engineers Inc.
229-232
页数4
ISBN(电子版)9781479947270
DOI
出版状态已出版 - 23 9月 2014
活动9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, 美国
期限: 13 4月 201416 4月 2014

出版系列

姓名9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014

会议

会议9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
国家/地区美国
Waikiki Beach
时期13/04/1416/04/14

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