Joining of 3D C/SiC composites to niobium alloy

Three-dimensional C/SiC was successfully joined to niobium alloy with a Ti-Cu bi-foil interlayer by a two-stage joining process: at 800 °C for 30 min under 6 MPa and at 1020 °C for 8-120 min under 0.01-0.05 MPa. The results showed that the residual Cu layer at the joining interface relaxed the thermal stress of the joint effectively, and the Ti-Cu eutectic liquid, formed by the contact melting of Ti-Cu, not only infiltrated into C/SiC, but also reacted with the SiC coating of C/SiC. These characteristics were beneficial to the joint, of which the shear strength was as high as 34.1 MPa.