Inter-hole interference with creep behavior of inclined film cooling holes in complex temperature fields

This study explores the inter-hole interference with the creep behavior of film cooling holes in nickel-based single crystal superalloys under complex temperature fields through combined Conjugate Heat Transfer (CHT) and Crystal Plasticity Finite Element Method (CPFEM) simulations. The investigation focuses on analyzing the stress distribution around the holes and rupture paths under complex flow conditions. Results show that as the blowing ratio increases, the primary rupture path among multiple holes gradually migrates from the holes in the central region under a uniform temperature field to the holes at the edges. Under the inter-hole interference of the temperature field, the temperature gradient along the wall thickness direction decreases, while the temperature gradient between holes increases. This results in higher temperatures at the edge holes compared to those at the center, leading to reduced creep resistance at the edges. The inter-hole interference of the stress field causes a cold-end stress concentration due to the temperature gradients inside and between the holes, which increases with time. The inter-hole interference of the temperature and stress field jointly governs the creep rupture behavior of the film cooling holes.