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Influence of solidification rate on solid-liquid interface of Si-Ta alloy

  • Chun Juan Cui
  • , Jun Zhang
  • , Kun Wu
  • , De Ning Zou
  • , Lin Liu
  • , Heng Zhi Fu
  • Xi'an University of Architecture and Technology
  • Northwestern Polytechnical University Xian

科研成果: 期刊稿件文章同行评审

摘要

The influence of solidification rate on the solid-liquid interface of Si-Ta alloy was studied by the zero power method. The results show that the solid-liquid interface morphology has the following evolution processing: planar interface→shallow cell interface→cell interface→shallow cell interface→planar interface when the solidification rate varies from 0.3 mm/min to 9.0 mm/min. At the lower solidification rates, the experiment results can be consistent with Jackson-Hunt theory well. However, there is a deviation between the theory calculation and the experiment at the higher solidification rates. This is caused by the change of the thermodynamics and kinetics, and the solid-liquid interface can get to planar interface at the solidification rate V=5.0 mm/min.

源语言英语
页(从-至)60-64
页数5
期刊Cailiao Gongcheng/Journal of Materials Engineering
8
出版状态已出版 - 8月 2012

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