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In-Situ Formation of Spatially Oriented Interfacial Cu0 in Dual-Plasmon Resonance Coupling ZnIn2S4/Cu-Cu3-xP Heterojunction for Full-Spectrum Photocatalytic Hydrogen Evolution

  • Sibi Liu
  • , Youzi Zhang
  • , Yijin Wang
  • , Yong Li
  • , Zhaosheng Xia
  • , Weizhe Chen
  • , Junchao Zhou
  • , Shujie Zhang
  • , Zhike Liu
  • , Xiaolin Zhu
  • , Xingang Ren
  • , Jahan B. Ghasemi
  • , Xuanhua Li
  • Northwestern Polytechnical University Xian
  • Shaanxi Normal University
  • Anhui University
  • University of Tehran

科研成果: 期刊稿件文章同行评审

摘要

Integrating plasmonic materials can extend the light harvest and enhance photocatalytic H2 production via localized surface plasmon resonance (LSPR). However, the sluggish utilization of LSPR-induced hot carriers due to poor interfacial coupling is the key issue. Here, we demonstrate a dual LSPR coupling ZnIn2S4/Cu-Cu3-xP heterostructure with in-situ formation of spatially oriented interfacial Cu0, which is achieved by the interfacial electrons’ directional transfer from ZnIn2S4 to Cu3-xP and partial reduction of Cu+ to metallic Cu0. The dual LSPR coupling of Cu and Cu3-xP enhances absorption and localized electric field by 21.4-fold/7.1-fold in the visible region and 3.3-fold/1.4-fold in the near-infrared, respectively, achieving full-spectrum photon harvesting. More critically, the spatially oriented interfacial Cu0 acts as a charge transport channel, reducing the charge transfer activation energy by 65%, collectively prolonging the carrier lifetime by 707.7-fold, and boosting directional hot electrons extraction. Consequently, interfacial Cu0-induced dual LSPR effect achieves an order-of-magnitude enhancement in photocatalytic activity, reaching a value of 43.3 mmol g−1 h−1 that surpasses previous sulfide-based photocatalysts. This research highlights a reinforced interface charge transport pathway for directional hot carrier extraction via valence state modulation, paving a promising route for designing high-activity plasmonic photocatalytic systems.

源语言英语
期刊Advanced Functional Materials
DOI
出版状态已接受/待刊 - 2026

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