TY - JOUR
T1 - Hot deformation behaviors of arc melted and heat treated Nb[sbnd]Si based ultrahigh temperature alloys
AU - Tang, Ye
AU - Guo, Xiping
N1 - Publisher Copyright:
© 2019 Elsevier Ltd
PY - 2019/11
Y1 - 2019/11
N2 - The difference in hot deformation behaviors of arc melted (AM) and heat treated (HT) Nb[sbnd]Si based ultrahigh temperature alloys has been investigated at temperatures of 1250 and 1410 °C respectively and a strain rate of 0.001 s−1. AM alloy exhibits a higher peak stress than HT alloy. The evolution of deformed microstructure signified by the change in silicide shape and size, has been obviously restrained in HT alloy compared to the AM one. During deformation at 1250 °C, continuous dynamic recrystallization (CDRX) of Nbss has been promoted in AM alloy compared with HT alloy, while CDRX process of Nb5Si3 shows little difference in both alloys. At a higher deformation temperature of 1410 °C, CDRX process of both Nbss and Nb5Si3 is slower in AM alloy than in HT alloy. Smaller Nbss grains have formed in AM alloy than in HT alloy after a height reduction of 60%, leading to a larger stress reduction during flow softening in the former.
AB - The difference in hot deformation behaviors of arc melted (AM) and heat treated (HT) Nb[sbnd]Si based ultrahigh temperature alloys has been investigated at temperatures of 1250 and 1410 °C respectively and a strain rate of 0.001 s−1. AM alloy exhibits a higher peak stress than HT alloy. The evolution of deformed microstructure signified by the change in silicide shape and size, has been obviously restrained in HT alloy compared to the AM one. During deformation at 1250 °C, continuous dynamic recrystallization (CDRX) of Nbss has been promoted in AM alloy compared with HT alloy, while CDRX process of Nb5Si3 shows little difference in both alloys. At a higher deformation temperature of 1410 °C, CDRX process of both Nbss and Nb5Si3 is slower in AM alloy than in HT alloy. Smaller Nbss grains have formed in AM alloy than in HT alloy after a height reduction of 60%, leading to a larger stress reduction during flow softening in the former.
KW - Dynamic recrystallization
KW - Electron backscatter diffraction
KW - Heat treatment
KW - Microstructure
KW - Nb[sbnd]Si based ultrahigh temperature alloy
UR - https://www.scopus.com/pages/publications/85068868846
U2 - 10.1016/j.ijrmhm.2019.105015
DO - 10.1016/j.ijrmhm.2019.105015
M3 - 文章
AN - SCOPUS:85068868846
SN - 0263-4368
VL - 84
JO - International Journal of Refractory Metals and Hard Materials
JF - International Journal of Refractory Metals and Hard Materials
M1 - 105015
ER -