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High-Temperature Flexural Properties and Failure Mechanisms of MoSi2–B4C Modified Quartz Fabric/Boron-Phenolic Ceramizable Composites

  • Yong Deng
  • , Xinran Gao
  • , Ying Li
  • , Huanfang Wang
  • , Minxian Shi
  • , Chao Zhang
  • Northwestern Polytechnical University Xian
  • Chongqing Jiaotong University
  • Zhengzhou University of Aeronautics
  • Wuhan University of Technology

科研成果: 期刊稿件文章同行评审

2 引用 (Scopus)

摘要

The incorporation of inorganic fillers has demonstrated remarkable potential in enhancing ablation resistance and mechanical performance of polymer composites. However, the evolution of fracture properties of ceramizable composites with temperature remains insufficiently understood, which is significant to the safety and application in thermal protection systems. In this study, the thermal stability, high-temperature flexural properties, and failure mechanisms of MoSi2–B4C particles modified quartz fabric/boron-phenolic ceramizable composites were investigated. Through three-point bending tests conducted from 25°C to 1100°C, we found that flexural strength generally declines with the rising temperature and decreases as the holding time increases from 10 to 15 min. The high-temperature failure mechanisms of the ceramizable composites were analyzed through macro and micro analysis. It is found that the matrix thermal degradation, accompanied by interface deterioration and multiscale structural damage, is the primary mechanism for the significant reduction in high-temperature flexural strength. However, the ceramization reactions of MoSi2 and B4C contribute to enhanced high-temperature mechanical properties, resulting in an unprecedented improvement in flexural strength observed at 900°C. Moreover, a high-temperature strength model for these ceramizable composites was developed. These findings provide valuable insights for evaluating the performance and potential applications of ceramizable composites in thermal protection systems.

源语言英语
期刊论文编号e57763
期刊Journal of Applied Polymer Science
142
46
DOI
出版状态已出版 - 10 12月 2025

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