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Functional Reliability Modeling of AFSS Under Thermal Loading

  • Xiaofeng Xue
  • , Chaowei Huang
  • , Guoguo Fu
  • , Zhuorui Lin
  • , Zheng Wei
  • , Yunwen Feng
  • Northwestern Polytechnical University Xian
  • Electromagnetic Windows

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The reliability of active frequency selective surfaces (AFSS) under complex operational environments has become increasingly critical, with diode failure caused by solder joint fatigue cracking being a key factor leading to degradation of wave transmission performance. This paper addresses the structurefunction coupled degradation mechanism of AFSS subjected to thermal cycling loads and proposes a multi-scale reliability modeling approach. First, a thermo-mechanical coupled finite element model considering component power dissipation boundary conditions is developed to compute the plastic strain response of solder joints under typical temperature cycles. Based on fatigue life models, the temporal sequence discontinuity pattern of functional failure chains is predicted. Subsequently, electromagnetic simulations analyze the evolution of wave transmission characteristics under different failure chain states, revealing a dynamic mapping relationship among thermal cycling excitation, solder joint damage, diode failure, and electromagnetic performance degradation. Results indicate that the functional failure chains of AFSS fail sequentially at 901, 1045, and 1072 cycles. As the number of failed chains increases, wave transmission performance deteriorates significantly, evidenced by reduced passband transmission coefficients, shifted resonance points, and increased in-band fluctuations, ultimately approaching a bandstop state with complete disconnection. Notably, in the X-band, wave transmission exhibits high sensitivity to structural damage. Using the transmission rate variation ratio at 10.1GHz resonance frequency as a key degradation indicator, with a failure threshold set at 60%, the task lifetime of AFSS is determined to be 901 cycles. The proposed modeling framework systematically reveals the multi-scale evolution mechanism of AFSS functional degradation, providing a theoretical basis and engineering support for reliability prediction and optimal design of active electromagnetic structures in complex environments.

源语言英语
主期刊名2025 5th International Conference on Mechatronics Technology and Aerospace Engineering, ICMTAE 2025
出版商Institute of Electrical and Electronics Engineers Inc.
311-318
页数8
ISBN(电子版)9798331598235
DOI
出版状态已出版 - 2025
活动2025 5th International Conference on Mechatronics Technology and Aerospace Engineering, ICMTAE 2025 - Fuzhou, 中国
期限: 26 9月 202528 9月 2025

出版系列

姓名2025 5th International Conference on Mechatronics Technology and Aerospace Engineering, ICMTAE 2025

会议

会议2025 5th International Conference on Mechatronics Technology and Aerospace Engineering, ICMTAE 2025
国家/地区中国
Fuzhou
时期26/09/2528/09/25

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