Formation mechanism of DKDP surface in single point diamond fly-cutting process and the resulting degradation of laser-induced damage performance

Laser damage performance of DKDP (KD_2xH₂(₁₋x₎PO₄) crystal is largely determined by the surface microstructures generated in the manufacturing process, more specifically, single point diamond fly-cutting process. However, because of the lack of knowledge about the formation mechanism and damage performance of the microstructures, laser induced damage of DKDP crystal remains a key issue limiting the output energy of the high power laser systems. In this paper, the influence of fly-cutting parameters on the generation of DKDP surface and the underlying material deformation mechanism have been investigated. Except for cracks, two kinds of new microstructures, namely micro grains and ripples, have been found on the processed DKDP surfaces. GIXRD, nano-indentation and nano-scratch test results prove that the micro grains are generated by the slip motion of the crystal, while the simulation results show that the cracks are induced by the tensile stress formed behind the cutting edge. Moreover, the formation of micro grains can facilitate the plastic chip flow through the mechanism of grain boundary sliding, which will further lead to a periodic fluctuation of the chip separation point and the formation of micro ripples. Finally, laser damage test results demonstrate that cracks will degrade the damage performance of DKDP surface significantly, while the formation of micro grains and micro ripples has little impact. The results of this study can deepen the understanding of the formation mechanism of the DKDP surface during the cutting process and provide guidance to improve the laser-induced damage performance of the crystal.