Fabrication of graphite films/copper composites by vacuum hot pressing for high-efficiency thermal management property

Thermal management is of a crucial issue for the reliability and life of electronic equipment with high powder density. Herein, graphite films (GFs) coated with SiC layers (SiC@GFs) and copper films (CFs) were used to fabricate SiC@GFs/CFs composites by hot-pressing method to obtain promising thermal transfer performance. Results displayed that SiC@GFs distributed in CFs matrix with orderly orientation. Furthermore, SiC@GFs/CFs composites displayed a good interface bonding and low thermal resistance for efficient thermal transfer property. The thermal conductivity (TC) of 485.2 W/m·K was obtained with the CFs loading of 60 vol %, which increased about 16.5 % than pure CFs matrix (397 W/m·K). Furthermore, the coefficient of thermal expansion (CTE) of all prepared composites was less than 2.18×10^-5 K^-1. The construction of the sandwich structure in Cu-matrix composites provides new ideas for the preparation of excellent thermal management materials.