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Enhancing transverse creep resistance of LPBF-fabricated IN718 via time-controlled solution treatment and Σ3 twin boundary engineering

  • Donghao Xia
  • , Mengyu Jia
  • , Guoyin Xie
  • , Shuai Tang
  • , Gang Yang
  • , Chuanyun Wang
  • , Hongchao Kou
  • Northwestern Polytechnical University Xian
  • Ltd
  • Chongqing University

科研成果: 期刊稿件文章同行评审

摘要

This study systematically investigated the effect of solution treatment time on the microstructure and mechanical properties of IN718 superalloy fabricated by laser powder bed fusion (LPBF), with a focus on its transverse creep behavior. Specimens were solution-treated at 1050 °C for 1-4 h followed by standard two-step aging, to examine the dissolution of Laves phase, recrystallization kinetics, and evolution of Σ3 annealing twin boundaries. Results reveal that 3 h hold at 1050 °C (ST-3h) provides an optimal kinetic balance, achieving complete Laves phase dissolution and producing a fully recrystallized, fine equiaxed grain structure containing approximately 60% Σ3 twin boundaries. This refined microstructure effectively eliminated mechanical anisotropy, enabling transverse tensile properties to achieve parity with longitudinal performance. Notable, the ST-3h specimens exhibited a transverse terminated creep duration exceeding 330 h at 650 °C under 620 MPa, substantially outperforming most reported non-HIPed LPBF IN718 counterparts in the transverse orientation. Post-creep microstructural analysis indicates that the enhanced performance originates from a dual strengthening mechanism: the γ'/γ" co-precipitates promote localized plastic slip and deformation twinning to accommodate strain, while the high density of Σ3 twin boundaries forms a stabilized grain boundary network that effectively suppresses cavity nucleation and crack propagation. This work establishes a clear heat treatment window and provides a theoretical foundation for overcoming the limited transverse creep resistance LPBF-processed superalloys.

源语言英语
文章编号150173
期刊Materials Science and Engineering: A
961
DOI
出版状态已出版 - 6月 2026

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