TY - JOUR
T1 - Effect of time-varying on interface synergy and fractional-order modeling of nonlinear strength degradation in SiCf/PyC/SiC composites under 1350 ℃
AU - Shi, Xinhao
AU - Li, Hanxiang
AU - Han, Dongcheng
AU - Gao, Peng
AU - Lin, Hongjiao
AU - Sun, Jia
AU - Feng, Tao
AU - Tong, Mingde
N1 - Publisher Copyright:
© 2026 Elsevier Ltd.
PY - 2027/1
Y1 - 2027/1
N2 - This study investigates the influence of time-varying effects on the microstructural evolution and mechanical properties of SiCf/PyC/SiC composites under 1350 °C dynamic thermal scouring. Based on the capability of fractional calculus to describe systems with memory effects and long-range correlations, a High-Temperature Time-Dependent Strength Damage Model (HTDDM) was established using Caputo-type fractional derivatives. Systematic experiments and theoretical analysis reveal that the tensile strength exhibits a non-monotonic variation with thermal-scouring time, increasing followed by a subsequent decline. Results indicate that 2–3 h of thermal scouring represents the optimal process window. During this period, the interfacial bonding strength enters an adaptive-range, maintaining essential fiber pull-out mechanisms while in-situ Si-O-C whiskers trigger secondary toughening. Conversely, thermal scouring exceeding 5 h induces excessive volumetric expansion from SiO2 formation, a reversal from compressive to tensile residual stresses, and complete degradation of the PyC interphase. Ultimately, this leads to the collapse of the synergistic load-bearing system.
AB - This study investigates the influence of time-varying effects on the microstructural evolution and mechanical properties of SiCf/PyC/SiC composites under 1350 °C dynamic thermal scouring. Based on the capability of fractional calculus to describe systems with memory effects and long-range correlations, a High-Temperature Time-Dependent Strength Damage Model (HTDDM) was established using Caputo-type fractional derivatives. Systematic experiments and theoretical analysis reveal that the tensile strength exhibits a non-monotonic variation with thermal-scouring time, increasing followed by a subsequent decline. Results indicate that 2–3 h of thermal scouring represents the optimal process window. During this period, the interfacial bonding strength enters an adaptive-range, maintaining essential fiber pull-out mechanisms while in-situ Si-O-C whiskers trigger secondary toughening. Conversely, thermal scouring exceeding 5 h induces excessive volumetric expansion from SiO2 formation, a reversal from compressive to tensile residual stresses, and complete degradation of the PyC interphase. Ultimately, this leads to the collapse of the synergistic load-bearing system.
KW - Fractional calculus
KW - SiCf/PyC/SiC composites
KW - Strength damage
KW - Thermal scouring
KW - Time-varying effects
UR - https://www.scopus.com/pages/publications/105045970022
U2 - 10.1016/j.jeurceramsoc.2026.118723
DO - 10.1016/j.jeurceramsoc.2026.118723
M3 - 文章
AN - SCOPUS:105045970022
SN - 0955-2219
VL - 47
JO - Journal of the European Ceramic Society
JF - Journal of the European Ceramic Society
IS - 1
M1 - 118723
ER -