@inproceedings{9b6732f77c1b4873be41d646f0939424,
title = "Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Cu solder joints",
abstract = "The microstructure and interfacial IMC layer of Cu/SACPG/Cu and Cu/SAC0307/Cu solder joints were comparatively investigated after thermal aging at 150°C for 0h, 24h, 168h and 500h, respectively. Results show that the morphology of IMC at the interface of Cu/SAC0307/Cu solder joint was consistent with that at the interface of Cu/SACPG/Cu joint, which indicates that the addition of P and Ge had little effect on the IMC formation. The tiny particles attached to the Cu6Sn5 were Ag3Sn phase and Ge from the study of three dimensional morphology of IMC. The addition of trace P and Ge in the alloy reduced the thickness of IMC layer and decreased the growth rate of IMC layer with aging time increasing, and had lower impact on the growth rate of IMC layer of Cu3Sn.",
keywords = "IMC, Microstructure, SAC0307, Thermal aging",
author = "Xingchen Yan and Yichen Zhang and Chunyan Wang and Kexin Xu and Junjie Wang and Xicheng Wei",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 17th International Conference on Electronic Packaging Technology, ICEPT 2016 ; Conference date: 16-08-2016 Through 19-08-2016",
year = "2016",
month = oct,
day = "4",
doi = "10.1109/ICEPT.2016.7583335",
language = "英语",
series = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1185--1188",
editor = "Keyun Bi and Sheng Liu and Shengjun Zhou",
booktitle = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",
}